AR6100RR 8英寸全自动环切机器 (AR6100RR 8 INCH FULLY-AUTOMATIC RING DICING EQUIPMENT)
●特点
■四工位,多片协调加工,加工效率高。
■兼容性好,与市面上的其他类型设备,关键耗材兼容性高。
■全自动上下料、传输定位、清洗、解胶、取环,实现全自动运行模式,大大降低OP工作量。
■稳定的了TAIKO外环解胶和取环。
■定制化工作台设计,保证TAIKO工艺下晶圆特殊结构稳定加工。
■多轴联动环切技术,保证环切精度。
●FEATURE
■Four-station, multi-piece coordinated processing, highprocessing efficiency.
■Good compatibility with other types of equipment on themarket and high compatibility with key consumables.
■Fully automatic loading and unloading, transferring andpositioning, cleaning, ungluing and ring taking, realizing fullyautomatic operation mode, greatly reducing OP workload.
■Stable TAIKO outer ring ungluing and ring removal.
■Customized table design ensures stable processing of special structures of wafers under TAIKO process.
■Multi-axis linkage circumferential cutting technology to ensure the precision of circumferential cut.
[ Semiconductor Wafer ][ Semiconductor compound materials ][ 半导体晶圆 ][ 半导体化合物材料 ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2024/3/18 |
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3.4 MB |
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