AR9000RR 12 英寸全自动环切机器 (AR9000RR 12 INCH FULLY-AUTOMATIC RING DICING EQUIPMENT)

2024-06-18

●特点

■四工位,多片协调加工,加工效率高。

■兼容性好,与巿面上的其他类型设备,关键耗材兼容性高。

■全自动上下料、传输定位、清洗、解胶、取环,实现全自动运行模式,大大降低OP工作量。

■稳定的了TAIKO外环解胶和取环

■定制化工作台设计,保证TAIKO工艺下晶圆特殊结构稳定加工。

■多轴联动环切技术,保证环切精度

●FEATURE

■Four-station, multi-piece coordinated processing, highprocessing efficiency.

■Good compatibility with other types of equipment on themarket and high compatibility with key consumables.

■Fully automatic loading and unloading, transferring andpositioning, cleaning, ungluing and ring taking, realizing fullyautomatic operation mode, greatly reducing OP workload.

■Stable TAIKO outer ring ungluing and ring removal.

■Customized table design ensures stable processing of special structures of wafers under TAIKO process.

■Multi-axis linkage circumferential cutting technology to ensure the precision of circumferential cut.


京创先进

AR9000RR

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Part#

全自动环切机器FULLY-AUTOMATIC RING DICING EQUIPMENT

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半导体晶圆 ]半导体化合物材料 ]Semiconductor Wafer ]Semiconductor compound materials ]

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2024/3/18

3.9 MB

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