AR9000 12英寸精密全自动划片机 (AR9000 12 INCH FULLY-AUTOMATIC DICING SAW)
●特点
■高速料盒框架扫描，防撞报警，高速传输定位，状态纠错能力强。
■全自动上下料、自动传输定位、自动对准切割、自动刀痕检测，降低OP工作量。
■主轴对装龙门工作台结构，双刀间距最小28MM，双轴切割工艺适应范围更广。
■优化双轴高效切割模式，效率较单机提高约80%。
■精密进口滚珠丝杆、直线导轨，Y向光栅尺闭环控制，高精度机台长时间保持。
■可定制特殊的切割框和工作台面，PACKAGE、 WAFER 双适应接口预留，方便快捷转化。
●FEATURE
■High-speed cassette frame scan, anti-collision alarm, high-speed transmission position, and strong status error correction capability.
■Fully automatic load and unload, automatic transmission and position, automatic alignment cut, automatic kerf check, reduce OP workload.
■Spindle to gantry table structure, double spindle spacing minimum 28mm, dual-spindle cutting process to adapt to a wider range.
■Optimized dual-spindle high-efficiency cutting mode, efficiency increased by about 80% compared to single equipment.
■ Precision imported ball screw, linear guide, Y-directional scale closed-loop control, high-precision machine to maintain a long time.
■Customizable cut frame and work surface, Package, wafer dual adaptation interface reserved for easy andfast conversion.
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[ 半导体晶圆 ][ 集成电路 ][ 光学玻璃 ][ QFN\ ][ DFN ][ BGA ][ Integrated Circuit ][ Semiconductor Wafer ][ Optical Glass ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2024/3/18 |
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4.2 MB |
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