AG6800 8英寸全自动减薄设备 (AG6800 8 INCH FULLY-AUTOMATIC GRINDER)

PublishTime：2024-06-18

●特点

■成熟稳定的加工过程。

■IN-FEED 主轴进绐式磨削加工，加工精度高。

■全自动流程错误处理，异常快速复机。

■全自动上下料与传输定位，大大降低OP工作量。

■便捷的操作与人机交互界面。

■多工位协同工作，加工效率高。

■干进干出加工 (DRY-IN & DRY-OUT)，表面光洁。

●FEATURE

■Mature and stable processing.

■In-Feed spindle feed type High precision grinding.

■Automatic Process Error Handling, Rapid Recovery from Abnormalities.

■Fully automatic loading and unloading with transfer positioning, greatly reducing OP workload.

■Convenient operation and human-machine interface.

■Multi-station collaborative work with high processing efficiency.

■Dry-in & Dry-Out processing, smooth surface.

Brand of Product：	京创先进
Part#：	AG6800 More Part#
Product Category：	全自动减薄设备、 FULLY-AUTOMATIC GRINDER More
Application：	[ Semiconductor Wafer ][ Semiconductor compound materials ][ SIC ][ 碳化硅 ][ 半导体晶圆 ][ 半导体化合物材料 ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2024/3/18
Version Number：
Data Encoding：
Data Size：	3.4 MB

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