SPL-15 HT Dielectric Technical Data
■Very low thermal resistance 100μm, <0.015 ℃-in²/W
■Product Thermal conductivity of 15 W/m-K
▲ (2oz Cu x 100μm SPL-15 HT x 1.5 Al)
■Dielectric Thermal Conductivity 10 W/m-K
■High operating temperature, ~ 200℃
■Lead-free solder compatible
■RoHS compliant and environmentally green
■Available as a laminated panel, RCC or prepreg
■Available on aluminum and copper base substrates
■Other substrates materials may be available.
■TCLAD Metal Core PCB’s (MCPCB’s) minimize thermal impedance and conducts heat more efficiently than standard printed wiring boards (PWB's).
■The differentiating technology of Thermal Clad resides in the dielectric. This datasheet highlights the performance characteristics of TCLAD SPL-15 HT.
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[ Inverter ][ Industrial motor drives ][ High temperature SiC IGBT modules ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2024/1/5 |
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Rev 2023 |
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D24-002 |
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223 KB |
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