HT Dielectric Technical Data
■Thermal resistance 3mil, 0.05°C-in2/W (0.32℃-cm²/W)
■Product Thermal conductivity of 4.1 W/m-K
■High Voltage Strength
■High temperature applications
■Lead-free solder compatible
■Eutectic AuSn compatible
■RoHS compliant and environmentally green
■Available on aluminum and copper base substrates
▲ Other substrates materials may be available
■Thermal Clad Metal Core PCB’s (MCPCB’s) minimize thermal impedance and conducts heat more efficiently than standard printed wiring boards (PWB's). These substrates are more mechanically robust than Direct Bond Copper (DBC) construction.
■The differentiating technology of Thermal Clad resides in the dielectric. This datasheet highlights the performance characteristics of Thermal Clad HT dielectric
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[ Heat Rails ][ Solid state relays ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2023/5/20 |
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Rev 2023 |
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D02-013 |
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221 KB |
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