SFL-12 Dielectric Technical Data
■Thermal resistance 100μm, 0.06 ℃-in²/W
■Product Thermal conductivity of 12 W/m-K
▲ (2oz Cu x 100μm SFL-12 x 1.5 Al)
■High Electrical Strength
■Lead-free solder compatible
■RoHS compliant and environmentally green
■Available as a laminated panel, RCC or prepreg
■Available on aluminum and copper base substrates
▲Other substrates materials may be available.
■TCLAD Metal Core PCB’s (MCPCB’s) minimize thermal impedance and conduct heat more efficiently than standard printed wiring boards (PWB's).
■The distinguishing difference of Thermal Clad resides in the dielectric. This datasheet highlights the performance characteristics of TCLAD SFL-12 dielectric.
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[ LED Lighting ][ Motor drives ][ Solid state relays ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2024/2/5 |
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Rev 2024 |
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D27-001 |
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703 KB |
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