987650-2584 EdgeLine® High-Speed Edge Card Connectors

2022-06-13

●Low-profile EdgeLine® High-Speed Edge Card Connectors support data rates up to 25 Gbps and are available in multiple orientations and PCB thicknesses for use in high-signal transmissions and high-density signal applications
●Features and Benefits
■High-speed differential contact design: Provides excellent signal integrity; performance up to 25 Gbps, depending upon the application
■Multiple PCB thicknesses (1.57 to 3.18mm ): Accommodates a variety of PCB thicknesses on complex product designs
■Surface mount terminal options: Enables high-speed pick-and-place assembly, as well as back-to-back connector placement
■Press-fit, compliant-pin terminal options: Allows easy board termination using flat-rock tooling
■Common (singulated) ground: Optimizes connector performance with dedicated differential pairs, or provides the maximum flexibility of an open array: Improves PCB alignment during mating
■Center key available on certain circuit sizes:
■Multiple circuit sizes available: Facilitates design flexibility for signal and power assignment
■Low profiles: CoPlanar connector 6.44mm above PCB; CoEdge connector 3.50mm above and below PCB. Provides enhanced air flow and thermal management. Secures the connector to the PCB and improves board alignment during mating
■Keying and locking features available (0.80mm pitch CoEdge connectors only)

MOLEX

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High-Speed Edge Card ConnectorsVertical Edge Card Connector

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Telecommunications ]Storage ]Networking ]Computing systems ]PCIe ]SAS ]SATA ]Storage systems ]Industrial ]MIL/Aerospace ]C4ISR ]High-end servers ]

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2015.03

Rev. 4

324 KB

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