NEOPRESS HIGH-SPEED PRESS-FIT MEZZANINE SYSTEM OPTIMIZES PCB DESIGN FLEXIBILITY All-In-One Modular Triad Wafer ConfigurationDelivers Major Improvements—Space Savings, Fully Configurable Press-Fit Technology, Faster Lead Times
●All-In-One Modular Triad Wafer Configuration Delivers Major Improvements—Space Savings, Fully Configurable Press-Fit Technology, Faster Lead Times
●BUSINESS: CHALLENGEMultiple diverse industries rely on mezzanine technologies to make board-to-board connections—from telecommunications and networking to medical and industrial automation equipment. High-density hubs, NAS towers and rack-mount servers, any application that uses a backplane connection is typically accompanied by a mezzanine card. Designers need strategies to achieve higher speeds without monopolizing valuable PCB real estate. The number of differential pairs and mix of signal and power requirements are important considerations when choosing a high-speed mezzanine connector. Traditional surface-mount (SMT) connectors are a solid option but not without drawbacks. A soldered SMT connector permanently affixed to a costly PCB makes reworking a board much more challenging. Customizing an SMT connector can drive up cost, manufacturing processes and time to market. Modular mezzanine systems featuring a high-speed triad wafer design greatly simplified PCB routing in high-density applications. However, many customers wanted a press-fit version to provide even greater design flexibility.
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[ telecommunications ][ networking ][ medical automation equipment ][ industrial automation equipment ] |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2017.06 |
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721 KB |
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