COOLPROVIDE™ / CPSS
●Features
■Super compliable (ASKER C 8) material minimizes thermal resistance
■Compliable thermal pad with excellent compressive stress relaxation.
■that reduces the load to heat element and PCB.
■Silicone-free, no siloxane outgassing.
■Oil bleeding is reduced compared to silicone-based thermal materials.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018/8/8 |
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87 KB |
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