Tflex 300 Series Thermal Gap Filler
■Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times.
■Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.
■Tflex™ 300H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.
■Tflex™ 300TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner offers a guaranteed dielectric barrier, and easier part handling for mass production.
●FEATURES AND BENEFITS
■Extreme compliancy allows material to “totally blanket” components
■Thermal conductivity of 1.2 W/mK
■Low compression set enables the pad to be reused many times
■Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
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Tflex 300 Series 、 Tflex 300 、 Tflex™ 300 、 Tflex™ 340 、 Tflex™ 380DC1 、 Tflex™ 3120TG 、 Tflex™ 3200H 、 Tflex™ 300H 、 Tflex™ 300TG |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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9-18-2023 |
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246 KB |
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