Tflex™ HD90000 Series Thermal Gap Filler
Laird’s Tflex™ HD90000 is the latest product in our High Deflection series. Tflex™ HD90000 combines 7.5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.
Tflex™ HD90000 is available in thickness from 0.040” (1000 μm) to 0.200” (5000 μm). Laird can provide material to meet your production needs in any region through our local production facilities. Please contact your local Laird sales or field engineering contact for samples or questions.
FEATURES AND BENEFITS：
●7.5 W/mK thermal conductivity
●Low pressure versus deflection
●Excellent surface wetting for low contact resistance
●Minimizes board and component stress
●Low Outgassing
●Low D3-D20 (< 20ppm)
●Large tolerance applications
●Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
|
Tflex HD91000 、 Tflex HD91500 、 Tflex HD92500 、 Tflex HD95000 、 Tflex™ HD90000 |
|
|
|
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
2017/12/17 |
|
|
|
|
|
|
|
|
240 KB |
- +1 Like
- Add to Favorites
Recommend
- Laird Releases Tflex™ Sf10 Series, a Silicone-free Gap Filler Delivering 10 W/mk Thermal Conductivity
- Laird Signed an Authorized Distributor Agreement with Sekorm
- Laird Offers Solutions for Datacenter Optical Transceivers and Modules
- Laird Performance Materials‘ new electrically conductive elastomers EcE 130 and EcE 135
- The Laird™ Ttape™ 1000A thermally conductive adhesive tape delivers best-in-class thermal resistance
- Laird Performance Materials‘ Graphite-over-Foam, GOF3000 thermal and EMI gasket，Shield EMI and transfer heat in compact spaces
- Sekorm Offers More Than 150,000 Electronic Components in Stock, Ensuring Supply Chain Assurance
- More than 150 Electromechanical Components Brands Cooperate with Sekorm
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
