Tflex™ HP34 Series Thermal Gap Filler
●Tflex HP34 is a new development product within Laird’s high-performance material portfolio. The high performing gap filler consists of graphite fibers expertly aligned to provide a very high bulk thermal conductivity. In addition to the high bulk Tc, Tflex HP34 is uniquely designed to maintain its thermal performance within an application under increased pressure. Best performance will occur at lower pressures, 10-30 psi.
■FEATURES AND BENEFITS
●34 W/mK bulk thermal conductivity
●Silicone Free formulation
●Maintains thermal performance under increased pressure
●Low contact resistance with mating surfaces
●Environmentally friendly solution that meets RoHS and REACH
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Tflex™ HP34 Series 、 HP34 Series 、 Tflex™ HP34 、 Tflex HP34 、 HP34 |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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08182023 |
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A18332-00 |
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861 KB |
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