Package Level EMI Shielding Solutions: PARKER CHOMERICS DELIVERS NOVEL, ADVANCED AND COST-EFFECTIVE PACKAGE LEVEL EMI SHIELDING SOLUTIONS
To deliver advanced functionality and performance, board and semiconductor package designers must become Tetris experts - working together to tightly pack semiconductor devices on PCBs in the most efficient ways possible without causing EMI issues. Mobile electronic device OEMs have no tolerance for EMI issues since performance and reliability drive consumer demand in this market.
To eliminate potential EMI issues caused by densely-populated PCBs, PCB and semiconductor designers are investigating novel new ways of shielding semiconductor devices and printed circuit boards. Traditional metal EMI shields are no longer an option, as they take up too much board space and therefore reduce the overall competitive functionality of the mobile electronic device.
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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July 2018 |
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