CHOMERICS THERMFLOW® T557 Tested with Voids TEST REPORT
●INTRODUCTION：
■The impact of voids or missing material on thermal impedence of T577 was examined
●METHOD：
■A metal probe was use to make holes/voids in T557 pads. Three samples were generated, one with no voids, one with small voids and one with large voids. Pictures on the pads can be seen below, Figure 1.
■Thermal impedence was measured per a modified ASTM 5470. The test pressure was 50 PSI and the test temperature was 70°C. Two samples were tested for each void size.
|
|
|
|
|
|
|
Test Report |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
April 18, 2006 |
|
|
|
|
|
TR 1008 EN |
|
|
161 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
