MULTIPHASE™ - T557 & T558 Low Thermal Resistance Thermflow™ Phase Change Pads
phase change pads. T557 is a 0.005 inch (0.13mm)thick, inherently adhesive film that softens at device operating temperatures resulting in “grease-like”performance. Unlike traditional phase change
materials, Multiphase materials incorporate melting metallic fillers as well as polymer systems to minimize thermal resistance
THERMFLOW™ T558 is recommended for applications where rework and ease of disassembly are important.
T558 is the same phase change material as T557 which has been coated on one side of a conformal metal foil
carrier. This new material provides the high performance properties typical of free-film phase change materials
with the added benefit of easy removal. It is easily attached onto a heat sink or heat spreader, leaving the metal
foil surface exposed. This foil eliminates the need of a protective liner, which simplifies the final assembly
process and minimizes shipping concerns and contamination issues.
T557 & T558 differ from other phase change materials because they have two phase change points. For
optimum performance, the pads must be exposed to temperatures above 65ºC during operation or by a burn-in
cycle. If the operation temperature design is lower than 65°C, material should see a one time burn-in cycle to
achieve lowest thermal impedance. Allowing the monitored electronic component to reach >65°C (only one time)
the 557/558 pads fully change phase and obtain MBLT (minimum bond-line thickness) and maximum surface
wet out. After this melt temperature is reached once, the electronic component can now run at the lower design
temperatures with resultant superior thermal performance.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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04/06 |
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TB 1014 EN |
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278 KB |
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