CHO-BOND® 1038 and 1121 ONE COMPONENT ELECTRICALLY CONDUCTIVE SILICONE SEALANT (1121 VOC FREE VERSION)
●CHO-BOND 1038 is a silver-plated copper filled, one-component conductive silicone. It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. Minimum recommended bond line for CHO-BOND 1038 is 0.007 inches (0.18mm). In addition, CHO-BOND 1038 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (less than 150 psi) is required. CHO-BOND 1038’s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures. For applications requiring zero volatile organic compounds (VOCs) or minimal shrinkage, Parker Chomerics offers a solvent free version of CHO-BOND 1038 called CHO-BOND 1121.
●For best adhesion results, CHO-BOND 1038 should be used in conjunction with CHO-BOND 1086 primer. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters.
■Features and Benefits:
●One component
●Easy to use, no weighing or mixing required.
●Silver plated copper filler
●Excellent conductivity 0.010 ohm-cm
●Moisture cure silicone
●30 minute working life, rapid skin formation, 24 hr handling time, requires no pressure during curing, wide range of application temperatures. 1 week for full cure.
●Non corrosive cure mechanism
●No corrosive by-products generated during curing to damage substrate.
●Medium paste
●Easy to dispense, apply and spread, can be used on overhead or vertical surfaces.
●No VOCs version: CHO-BOND 1121
●Minimal shrinkage, no permits or ventilation required.
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CHO-BOND® 1038 、 CHO-BOND® 1121 、 CHO-BOND 1038 、 CHO-BOND 1121 、 50-02-1038-0000 、 50-02-1038-1000 、 50-33-1038-0000 、 50-01-1038-0000 、 50-31-1038-0000 、 50-01-1121-0000 、 50-10-1086-0000 、 50-04-1086-0000 、 50-01-1086-0000 |
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ONE COMPONENT ELECTRICALLY CONDUCTIVE SILICONE SEALANT 、 silver-plated copper filled, one-component conductive silicone |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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April 2020 |
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TB 1136 EN |
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221 KB |
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