CHO-BOND® 1038 One-Component Conductive Silicome RTV Adhesive/Sealant TECHNICAL BULLETIN
CHO-BOND® 1038 is an electrically conductive,one-component silicone adhesive/sealant that may be used for bonding EMI gaskets or for providing EMI and environmental protection as a caulk.This material cures on exposure to atmospheric moisture,and contains no acetic acid or other corrosive agents.
Cured CHO-BOND 1038 remains flexible and conductive at temperatures from -55℃ to +125℃.Uncured CHO-BOND 1038 is a smooth,non-flowing paste that may be knife spread or applied directly to a vertical surface.
CHO-BOND 1038 forms a cured skin within two minutes after exposure to atmospheric moisture,and,therefore,must be tooled within this time period.A full cure is obtained after room temperature aging at 50% relative humidity for one week.In many cases,a good set is obtained within 8 hours.
CHO-BOND 1038 is supplied in 1-lb.(454gm) caulking cartridges and 4 ounce metal evaluation tubes.
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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1.2 MB |
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