ST-250™ Cu Residue remover

2022-10-21
●ST-250™ Cu residue remover solution is specifically formulated for maximum compatibility with copper, advanced barrier layer, and etch-stop materials.
●An intermediate rinse solvent is not required for most applica-tions. If corrosion sensitivity or other factors dictate the use of an intermediate rinse, PSR-200 is recommended. Do not use isopropyl alcohol as an intermediate rinse.
●ST-250 can be used in automated batch spray equipment and single wafer tools. For process details appropriate to the equip-ment used in your facility, contact Entegris Applications Engi-neering or Sales staff for specific process recommendations.
●Bath life of ST-250 is typically greater than 24 hours and is depen-dent upon the rate of water evaporation from the product. Closed systems provide longer bath lives than open systems due to lower rates of water evaporation. Shelf life is generally 12 months from date of manufacture if properly stored. Refer to ST-250 Safety Data Sheet for specific handling and storage information.
●ST-250 is compatible with a wide variety of processing materials. See table on page 2 for selecting materials compatible with its use. For information on materials not listed, contact Entegris Applications Engineering or Sales staff.

Entegris

ST-250

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Part#

Cu Residue remover

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Copper dual Damascene ]

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Datasheet

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2017/11/9

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