XtremeSpeed™ RO1200™ Bondply Datasheet

2022-08-11
●XtremeSpeed™ RO1200™ extremely low loss, ceramic filled, non-glass reinforced PTFE bondply is designed for use in high speed digital applications. By combining the lowest loss resin system and the highest performance rolled copper foil, the XtremeSpeed RO1200 material system is well suited to address the performance needs of 56Gbps and 112Gbps system architecture. The all-RO1200 system is industry leading and unrivaled in the market place.
●The RO1200 bondply complements the XtremeSpeed RO1200 laminate products by offering a matched dielectric constant solution at all necessary digital design thicknesses. The RO1200 bondply material has a dielectric constant of 2.99 with a dissipation factor of 0.0012 at 10 GHz. Thickness options are 2.5, 3.0, 4.0, and 5.0mils. Plies can also be stacked in any combination to achieve the desired homogeneous outcome ensuring that proper impedance matching is obtained while maintaining the extremely low loss and high reliability characteristics of the all-RO1200 system. Applications with up to 42 metal layers have been successfully demonstrated using the RO1200 laminate and bondply system.
●Features and Benefits:
■Low dielectric constant of 2.99 @ 10 GHZ
◆Excellent electrical match to the XtremeSpeed RO1200 laminate materials
■Industry leading lowest loss of 0.0012 @ 10 GHz
◆Ensures very best in class insertion loss of -0.74 dB/in at 28 GHz (stripline, 5mil signal to ground spacing, all-RO1200 system)
■Low X/Y/Z axis CTE of 29 ppm/ ̊C throughout the temperature range of -55 ̊C to 288 ̊C
◆Contributes to outstanding thermal and mechanical performance in the most demanding applications

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