XtremeSpeed™ RO1200™ Bondply Datasheet
●The RO1200 bondply complements the XtremeSpeed RO1200 laminate products by offering a matched dielectric constant solution at all necessary digital design thicknesses. The RO1200 bondply material has a dielectric constant of 2.99 with a dissipation factor of 0.0012 at 10 GHz. Thickness options are 2.5, 3.0, 4.0, and 5.0mils. Plies can also be stacked in any combination to achieve the desired homogeneous outcome ensuring that proper impedance matching is obtained while maintaining the extremely low loss and high reliability characteristics of the all-RO1200 system. Applications with up to 42 metal layers have been successfully demonstrated using the RO1200 laminate and bondply system.
●Features and Benefits:
■Low dielectric constant of 2.99 @ 10 GHZ
◆Excellent electrical match to the XtremeSpeed RO1200 laminate materials
■Industry leading lowest loss of 0.0012 @ 10 GHz
◆Ensures very best in class insertion loss of -0.74 dB/in at 28 GHz (stripline, 5mil signal to ground spacing, all-RO1200 system)
■Low X/Y/Z axis CTE of 29 ppm/ ̊C throughout the temperature range of -55 ̊C to 288 ̊C
◆Contributes to outstanding thermal and mechanical performance in the most demanding applications
XtremeSpeed™ RO1200™ 、 RO1200™ 、 RO1200 、 XtremeSpeed RO1200 |
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[ Core/edge IP routers ][ switches ][ High performance computing (HPC) servers ][ High performance computing (HPC) switching ][ High performance computing (HPC) storage ][ Backplanes ][ Automated test equipment (ATE) ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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072822 |
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92-199 |
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426 KB |
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