XtremeSpeed™ RO1200™ Bondply Datasheet

PublishTime：2020-06-19

XtremeSpeed™ RO1200™ extremely low loss, ceramic filled, non-glass reinforced PTFE bondply is designed for use in high speed digital applications. By combining the lowest loss resin system and the highest performance rolled copper foil, the XtremeSpeed RO1200 material system is well suited to address the performance needs of 56Gbps and 112Gbps system architecture. The all-RO1200 system is industry leading and unrivaled in the market place.The RO1200 bondply complements the XtremeSpeed RO1200 laminate products by offering a matched dielectric constant solution at all necessary digital design thicknesses. The RO1200 bondply material has a dielectric constant of 2.99 with a dissipation factor of 0.0012 at 10 GHz. Thickness options are 2.5, 3.0, 4.0, and 5.0mils. Plies can also be stacked in any combination to achieve the desired homogeneous outcome ensuring that proper impedance matching is obtained while maintaining the extremely low loss and high reliability characteristics of the all-RO1200 system. Applications with up to 42 metal layers have been successfully demonstrated using the RO1200 laminate and bondply system.

Brand of Product：	ROGERS
Part#：	RO1200 、 XtremeSpeed™ RO1200™ 、 XtremeSpeed™ RO1200™ Bondply More Part#
Product Category：	low loss, ceramic filled, non-glass reinforced PTFE bondply More
Application：	[ Core/edge IP routers and switches ][ High performance computing (HPC) servers, switching and storage ][ Backplanes ][ Automated test equipment (ATE) ] More
Data Type：	Datasheet More
Safety & Environment Standards：	Lead Free 、 UL94 V-0 More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	022520
Version Number：
Data Encoding：	92-199
Data Size：	402 KB

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