RO1200TM and RO1200BPTM Extremely Low Loss Digital Laminate and Bondply
●RO1200™ product family includes copper clad ceramic filled,woven glass reinforced polytetrafluoroethylene (PTFE)cores and unreinforced ceramic filled PTFE bondply layers.RO1200 cores are available in thicknesses ranging from 0.003"to 0.010"and clad with 18 or 36 micron (0.5,1 oz and 2 oz/sq ft)reverse-treat or 18, 36,or 72 micron rolled copper foils.The RO1200BP™ bondply layers,available in thicknesses of 0.002",0.003", 0.004",and 0.005",can also be stacked to yield thicker copper plane:copper plane spacing.The RO1200 core and bondply materials are engineered to offer exceptional electrical performance and mechanical stability for the most demanding high speed applications.
●These guidelines are offered to provide fabricators with basic information on processing multilayer test vehicles using RO1200 core and RO1200BP bondply materials.These guidelines will be updated as new processing information is developed.For the most current and specific processing information,please contact a Rogers Technical Service or Sales Representative.
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2017/08/01 |
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Publication #92-538 |
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96 KB |
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