LOCTITE ABLESTIK ABP 2035SCR Technical Data Sheet

PublishTime：2022-07-26

■PRODUCT DESCRIPTION
●LOCTITE ABLESTIK ABP 2035SCR provides the following product characteristics:
▲Technology:Proprietary Hybrid Chemistry
▲Appearance:Red
▲Cure:Heat cure
▲Product Benefits:
◆One component
◆Low stress
◆Snap curable
◆Low cure temperature
◆Good dispense behavior
◆Compatible for use with encapsulant material
▲Application:Die attach
▲Filler Type:Silica
▲Typical Package Application:Smart Card
●LOCTITE ABLESTIK ABP 2035SCR non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces.

Brand of Product：	Henkel
Part#：	LOCTITE ABLESTIK ABP 2035SCR More Part#
Product Category：	non-conductive die attach adhesive More
Application：	[ Smart Card ][ high throughput die attach ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	January 2015
Version Number：
Data Encoding：
Data Size：	63 KB

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