LOCTITE ABLESTIK ABP 8038 Technical Data Sheet
■ LOCTITE ABLESTIK ABP 8038 provides the following product characteristics:
■ Technology: Acrylate
■ Appearance: Gold
■ Filler Type: Gold and Palladium
■ Cure: Heat cure
■ Product Benefits:
▲ Improved workability
▲ Excellent die shear strength
▲ Excellent electrical conductivity
▲ High thermal conductivity
■ Application: Die attach
■ Key Substrates: PPF and Au
● LOCTITE ABLESTIK ABP 8038 die attach adhesive is designed for high reliability leadframe packaging applications. This adhesive is formulated to eliminate silver migration concerns by replacing silver with gold and palladium.
Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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March 2013 |
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66 KB |
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