LOCTITE ABLESTIK ABP 84-3JT Technical Data Sheet
●LOCTITE ABLESTIK ABP 84-3JT provides the following product characteristics:
▲Technology:BMI Hybrid
▲Appearance:Light ivory liquid
▲Cure:Heat cure
▲Product Benefits:
◆Non-conductive
◆Insulating
◆Good adhesion to Cu and Ag
◆No resin bleed-out
◆Snap curable
▲Application:Semiconductor, Die attach
▲Key Substrates:Silver and Copper
▲Typical Package Application:SOP, SOT, QFN and DFN
●LOCTITE ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus and high adhesion at wirebond temperatures making the material suitable for use on copper wire bonding applications where die shift issues during processing should be avoided. It contains 1 mil spacers for better bondline and stress control.
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
December 2017 |
|
|
|
|
|
|
|
|
72 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
