LOCTITE ABLESTIK ABP 2036SF Technical Data Sheet
■ LOCTITE ABLESTIK ABP 2036SF provides the following product characteristics:
■ Technology: Proprietary Hybrid Chemistry
■ Appearance: Red
■ Filler Type: Silica
■ Cure: Heat cure
■ Product Benefits:
▲ Non-conductive
▲ Single component
▲ Fast cure
▲ Low cure temperature
▲ Low stress
■ Application: Die attach
● LOCTITE ABLESTIK ABP 2036SF non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces.
● LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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August 2015 |
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64 KB |
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