Building and Industrial Automation Trends Require Connectivity
● More complex, connected and modularized buildings require a significant increase in the number of internal systems that use multiple printed circuit board (PCB) and flex assemblies for sensors, cameras and multiple active module PCBs. Assemblies demand connectors with improved signal integrity (SI) for speed and robustness in tight spaces. And while connectivity is increasing, it must be accomplished without an increase in the product profile.
● The next wave of features propelled by industrial internet of things (IIoT) innovation will require increased internal PCB and flex assembly density within the same application profile. This will drive more modularity, with complex circuitry requiring additional semiconductors, memory, capacitors and resisters on multiple boards, increasing low-profile connector demand.
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Please see the document for details |
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2019.11 |
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