LOCTITE ABLESTIK 8006NS Technical Data Sheet
■ LOCTITE ABLESTIK 8006NS provides the following product characteristics:
■ Technology: Epoxy
■ Appearance: white
■ Cure: Heat cure
■ Product Benefits:
▲ B-Stageable
▲ Non-conductive
▲ Offers improved printability
▲ Engineered to accurately control bondline thickness and die tilt
■ Application: Die attach
■ Filler Type: Alumina/Silica
● LOCTITE ABLESTIK 8006NS non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This product is designed for application by stencil or screen printing. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. Once B-staged, this adhesive remains stable and can be placed into storage for several months. With proper die bonder setup along with incorporating adequate die placement pressure, a consistent minimum bondline thickness of 1mil can be achieved with minimal die tilt.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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April 2014 |
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67 KB |
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