LOCTITE ABLESTIK 8008 Technical Data Sheet
■ LOCTITE ABLESTIK 8008 provides the following product characteristics:
■ Technology: Proprietary Hybrid Chemistry
■ Appearance: Silver
■ Cure: Heat cure
■ Product Benefits:
▲ Electrically conductive
▲ Snap curable after B-stage
▲ High adhesion to metal leadframe surface
▲ Excellent printing and low surface roughness
▲ No voiding after cure
■ Application: Die attach
■ Filler Type: Silver
■ Substrates: Ag, Cu and PPF
■ pH: 4.7
● LOCTITE ABLESTIK 8008 snap curable adhesive is designed for small die sizes (<3mm). It exhibits moderate electrical and thermal conductivity. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. LOCTITE ABLESTIK 8008 should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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April 2014 |
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68 KB |
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