LOCTITE ABLESTIK 965-1L Technical Data Sheet
■ LOCTITE ABLESTIK 965-1L provides the following product characteristics:
■ Technology: Epoxy
■ Appearance: Silver
■ Cure: Heat cure
■ Product Benefits:
▲ Electrically conductive
▲ Stress absorbing
▲ Low levels of contaminants
▲ Void-free bondline with minimal bleed
■ Application: Die attach
■ pH: 5.5
■ Filler Type: Silver
● LOCTITE ABLESTIK 965-1L is designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion. It is designed for high speed, automated assembly operations.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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October 2014 |
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66 KB |
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