DESIGN GUIDE FOR IMPACT™ INTERCONNECT SYSTEMS

PublishTime：2022-02-17

●The Impact™ backplane connector system provides data rates up to 25 Gbps and superior signal density up to 80 differential pairs per inch. The Impact™ system's broad-edge-coupled technology enables low cross-talk and high signal bandwidth while minimizing channel performance variation across every differential pair within the system.
●Molex's Impact™ system offers multiple compliant-pin design options on both the daughtercard and backplane connectors, providing customers the ultimate flexibility to optimize their designs for superior mechanical and electrical performance.
●The Impact™ backplane connector system is designed for traditional backplane and/or midplane architectures to meet the growing demands of next-generation telecommunication and data networking equipment manufacturers. The Impact™ backplane connector system is offered in 2 pair,3 pair, 4 pair, 5 pair, and 6 pair traditional BP header and DC connector versions, with a complete range of guidance, power, coplanar, mezzanine, and high-performance cable solutions.

Brand of Product：	MOLEX
Part#：
Product Category：	HIGH SPEED INTERCONNECT SYSTEMS 、 BACKPLANE HEADER SIGNAL MODULES 、 DAUGHTERCARD RECEPTACLE SIGNAL MODULES 、 MEZZANINE RECEPTACLESIGNAL MODULES 、 COPLANAR HEADER (RAM) SIGNAL MODULES 、 POWER HEADER (PLUG)MODULES 、 POWER RECEPTACLE MODULES More
Application：	More
Data Type：	User's Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	07/13/2016
Version Number：	REVISION:B1
Data Encoding：	AS-76060-9997
Data Size：	1.8 MB

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