HSAL II Interconnect System PRODUCT OVERVIEW

2022-03-11
●Overview
■The robust HSAutoLink™ II interconnect system addresses the need for increasing bandwidth requirements in transportation applications through cost-competitive solutions that support a range of high-speed communication protocols.
●Scope
■This product overview contains supplemental information pertaining to the HSAutoLink™II Automotive Connector System. This product overview is broken into two main parts, sealed and unsealed connector systems. The 14-circuit products Production Part Approval Process (PPAP) is scheduled for third quarter 2020.

MOLEX

PCB HeadersCable Assemblies12 Circuit Sealed Plug6 Circuit Sealed Plug12 Circuit Sealed Inline Receptacle6 Circuit Sealed Inline Receptacle12CKT SEALED PLUG6CKT SEALED PLUG12 Circuit Sealed Vertical Header6 Circuit Sealed Vertical Header12 Circuit Sealed Right Angle Header6 Circuit Sealed Right Angle Header14 Circuit Unsealed Plug12 Circuit Unsealed Plug6 Circuit Unsealed Plug12 Circuit Unsealed Inline Receptacle6 Circuit Unsealed Inline Receptacle12CKT UNSEALED PLUG6CKT UNSEALED PLUG12 Circuit Unsealed Vertical Header6 Circuit Unsealed Vertical Header14 Circuit Unsealed Right Angle Header12 Circuit Unsealed Right Angle Header6 Circuit Unsealed Right Angle Header

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Supplier and Product Introduction

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English Chinese Chinese and English Japanese

February 24, 2020

REV. A2

PS-34861-001

2.1 MB

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