CMM Interconnect system
●This Board to Board, Board to Wire and Wire to Wire interconnect system benefits from the option of a mixed layout, giving the designer a choice of high frequency (up to 11 GHz), high power (up to 30 Amps), and low frequency (3A) contact configurations. 20 million standard arrangements are available in a short lead-time!
●Termination styles are available for through board solder, surface mount and press fit. An integral stainless steel locking mechanism or spring latching system offers security of interconnection, whilst a high temperature insulator allows infrared on vapor phase soldering (+260°C). Along with a small,space saving 2mm footprint, (enables up to 60% space saving over conventional 2.54mm systems),the system also features a high reliability contact design, which can be used under extreme vibration and environmental conditions.
[ extreme vibration ][ environmental ] |
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2021/03/26 |
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648 KB |
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