PQFN88 and PQFN56 Lead-free 2nd Level Soldering Recommendations for Vapor Phase Reflow Application Note

PublishTime：2022-01-10

●LS and LD Package description
■Transphorm’s PQFN (Power Quad Flatpack No Lead) package incorporates a DPC (Direct Plated Cu) substrate and a Cu lead frame encapsulated, in a green molding compound for bottom electrical connection and thermal contact to the PBC (printed circuit board). It provides high lateral electrical isolation and excellent heat dissipation similar to a D2Pak but in a thinner form factor.
●Features
■Low profile and lead inductance
■RoHS-compliant

Brand of Product：	Transphorm
Part#：	TPH3206LS 、 TPH3206LD 、 TPH320 More Part#
Product Category：	Printed circuit board More
Application：	More
Data Type：	Application note & Design Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	PQFN88;PQFN56
Language：	English Chinese Chinese and English Japanese
Date of Creation：	January 31, 2020
Version Number：
Data Encoding：	an0007.6
Data Size：	720 KB

Data section preview(2pages)

- The full preview is over. If you want to read the whole 12 page document,please Sign in/Register -

Download

+1 Like
Add to Favorites

Recommend

Technical Resources

More>

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Integrated Circuits