PQFN88 and PQFN56 Lead-free 2nd Level Soldering Recommendations for Vapor Phase Reflow Application Note
■Transphorm’s PQFN (Power Quad Flatpack No Lead) package incorporates a DPC (Direct Plated Cu) substrate and a Cu lead frame encapsulated, in a green molding compound for bottom electrical connection and thermal contact to the PBC (printed circuit board). It provides high lateral electrical isolation and excellent heat dissipation similar to a D2Pak but in a thinner form factor.
●Features
■Low profile and lead inductance
■RoHS-compliant
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Application note & Design Guide |
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Please see the document for details |
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PQFN88;PQFN56 |
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English Chinese Chinese and English Japanese |
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January 31, 2020 |
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an0007.6 |
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720 KB |
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