Application Note 0007
PQFN88 and PQFN56 Lead-free 2
nd
Level Soldering Recommendations for
Vapor Phase Reflow
Table of Contents
LS and LD Package description ......................................................................................................................................................... 2
Printed circuit board ........................................................................................................................................................................... 3
PCB footprint ............................................................................................................................................................................... 3
Pad surface ................................................................................................................................................................................. 4
Printed circuit board reflow solder and solder paste printing ........................................................................................................ 4
Solder stencil .............................................................................................................................................................................. 4
Solder paste ................................................................................................................................................................................ 5
Reflow soldering ......................................................................................................................................................................... 5
LSG and LDG Package description .................................................................................................................................................... 7
Printed circuit board ........................................................................................................................................................................... 7
PCB footprint ............................................................................................................................................................................... 7
Solder Stencil ...................................................................................................................................................................................... 8
JSG Package description.................................................................................................................................................................. 10
Printed circuit board ......................................................................................................................................................................... 10
PCB footprint ............................................................................................................................................................................. 10
Solder Stencil .................................................................................................................................................................................... 11
Disclaimer ......................................................................................................................................................................................... 12
Electrostatic discharge (ESD) .......................................................................................................................................................... 12
Moisture sensitivity level ................................................................................................................................................................. 12
January 31, 2020 transphormusa.com
an0007.6
2
Application Note 0007
LS and LD Package description
Transphorm’s PQFN (Power Quad Flatpack No Lead) package incorporates a DPC (Direct Plated Cu) substrate and a Cu lead
frame encapsulated, in a green molding compound for bottom electrical connection and thermal contact to the PBC (printed
circuit board). It provides high lateral electrical isolation and excellent heat dissipation similar to a D2Pak but in a thinner form
factor.
Features
• Low profile and lead inductance
��� RoHS-compliant
Figure 1. TPH3206LD – common drain package
configuration (bottom view)
Figure 2. TPH3206LS – common source package
………configuration (bottom view)