CXL Memory Modules (XMM)
●SMART develops CXL Type 3 (CXL.mem) memory products to address the industry’s need for more memory per processor core. The CXL interconnect specification allows for a significant expansion of memory form factor options leveraged from SSDs. SMART’s introductory CXL Memory Modules known as XMM are offered in the E3.S form factor.
●Why choose SMART Modular for CXL?
■SMART is a contributing member of the CXL consortium, closely collaborating with CPU and silicon suppliers to test for compatibility and feature completeness.
■SMART has PCB design and assembly to develop high speed memory and storage modules in variety of form-factors like DIMMs, E1.S, E3.S and PCIe add-in cards.
■SMART’s global manufacturing footprint and strong relationships with components suppliers minimizes disruption even in stringent supply-chain conditions.
■Customers can leverage SMART’s test and validation service for pre-screening memory modules for reliability and quality.
■SMART’s engagement in other emerging technologies like Gen-Z, OpenCAPI and persistent memory solutions such as NVDIMM-N.
●Key Features
■CXL-2.0 compatible with PCIe-Gen5 speeds running at 32GT/s
■Available in 64GB DDR5 memory capacity with expansion up to 256GB in future
■Supports Reliability, Availability and Serviceability (RAS) features added in CXL-2.0
■Available in EDSFF E3.S 2T (2U short) form-factor.
■Powered by only 12V supply from EDSFF compatible edge interface (SFF-TA-1009)
■Supports sideband interfaces for real-time debug, management and system update, enabling out-of-band management of the module
■Supports additional security features to protect data from side-channel attacks
●Applications
■Disaggregated pool of shared memory for HPC applications accessible over CXL fabric
■Secure memory for managing trusted keys and in-memory database
■OLTP Log Cache Acceleration
■In-line compression, encryption or vector atomic operations, transparent to CPU while using normal memory load/store semantics
■Targeted for 2U servers to enables memory expansion with up to 16 E3.S modules in single 2U server achieving better throughput than direct attached DDR5 DIMMs
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[ HPC applications ][ managing trusted keys ][ in-memory database ][ OLTP Log Cache Acceleration ][ In-line compression ][ encryption ][ vector atomic operations ][ 2U servers ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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09.14.21 |
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Rev.2 |
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1.1 MB |
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