Shenzhen Goldlink Tongda Electronics Co., Ltd THERMAL SOLUTION AND SERVICE
●Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is the first priority. The R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products.
●Products: Silicone Thermal Pad, Thermally Conductive Insulator, Silicone Putty Pad, Silicone Thermal Tape, Thermal lnterface Grease, Two-part Thermal Interface Sealing Compound, Silicone Thermal Gel, Thermal Interface Phase Change Materials and Non-Silicone type products.
●Applications: New energy vehicles, UAV, computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.
Selection catalogue
- Company Profile
- Low Density Thermally Conductivity Silicone Gel Pad/Stressless Silicone Thermal Putty Gel
- Thermal Pad
- Thermal Silicone Pad & Silicone Thermal Fiberglass/Film
- EMI absorber/Absorption Gel
- Two-part Liquid Thermal Gap Pad/PCMs/Non-Silicone Sealing Compound
- Silicone/Non-Silicone Thermal grease
- Silicone Thermal Tape
- Graphite Thermal radiation Pad/Vibration Dampening Silicone Pad
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