Tflex™ SF10 Thermal Gap Filler Application Guide
■Shelf life for Tflex SF10 is 1 year from date of shipment at the storage conditions specified below.
●Storage Conditions
■Recommended storage conditions are 0-35°C and relative humidity of 50%maximum. Store in original product packaging until ready for use.
■It is not recommended to store this product under excessive weight, as the product is susceptible to deflection at very low pressure.
●Storage After Applied to a Component
■It is recommended to keep product coveredand clean after applying it to a component and stored at ambient conditions.
●Handling of Material
■A light, visible and consistent residue on the liner is normal for this product and it will not affect the product's performance.
■The gap filler product is designed to be easily deflected in application (high compliancy) and can therefore stretch or compress when handled.
■During shipping and handling, the gap filler product can prematurely release from areas of the carrier liner.The premature release is visibly noticeable as voids or bubbles between liner and gap filler. This behavior does not impact the performance of the product as long the thickness remains in tolerance (+/- 10% of nominal thickness).
●Cut-Through Part Peeling Instructions
■Peel back one liner by separating it from the pad at one corner. Peel back the liner in one swift, consistent motion as close to an 180 angle as possible.
■Peel off the remaining clear liner by separating it from the pad at one corner. Peel back the liner in one swift, consistent motion as close to an 180" angle as possible. Ensure you are peeling the liner from the pad. Do not attempt to grasp the pad and peel it from the liner.
■Peel off the remaining clear liner by separating it from the pad at one corner. Peel back the liner in one swift, consistent motion as close to an 180°angle as possible.Ensure you are peeling the liner from the pad. Do not attempt to grasp the pad and peel it from the liner.
●Cut-Through Part ApplicationInstructions
■Remove the embossed (diamond) liner by separating it from the pad at one corner. Peel back the liner in one swift, consistent motion as close to an 180 angle as possible.
■Place the exposed side of the gap filler on the desired substrate by applying slight force to ensure the gap filler sticks.
■Peel off the remaining clear or embossed liner by separating it from the pad at one corner. Peel back the liner in one swift, consistent motion as close to an 180 angle as possible.
●Separation ofComponents and Removal of Tflex SF10
■To remove Tflex SF10, its recommended to heat the component and scrape away remaining parts of the pad. It is common for residue to be left after removing the pad from use. Residue can be wiped away with a dry cloth. If excess residue remains, it can be cleaned further with mineral spirits, followed by acetone.
|
|
|
|
Solutions |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
6/10/2021 |
|
|
|
|
|
A18319-00 |
|
|
284 KB |
- +1 Like
- Add to Favorites
Recommend
- Laird Releases Tflex™ Sf10 Series, a Silicone-free Gap Filler Delivering 10 W/mk Thermal Conductivity
- Laird Signed an Authorized Distributor Agreement with Sekorm
- Laird Offers Solutions for Datacenter Optical Transceivers and Modules
- Laird Performance Materials‘ new electrically conductive elastomers EcE 130 and EcE 135
- The Laird™ Ttape™ 1000A thermally conductive adhesive tape delivers best-in-class thermal resistance
- Laird Performance Materials‘ Graphite-over-Foam, GOF3000 thermal and EMI gasket，Shield EMI and transfer heat in compact spaces
- Sekorm Offers More Than 150,000 Electronic Components in Stock, Ensuring Supply Chain Assurance
- Ultra-Fast Soft Recovery Diode Module ESF100SS60S, Optimized to Reduce Losses and EMI/RFI in High Frequency Power Conditioning Electrical Systems
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
