Tflex™ SF10 Series Thermal Gap Filler
■Tflex™ SF10 is an innovative, high performing thermal material in Laird's gap filler portfolio. This silicone free material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components during deflection. Very little pressure is required to reach the lowest possible thermal resistance.
●FEATURES AND BENEFITS
■Silicone free formulation
■Low peak and residual pressure
■Excellent surface wetting for low contact resistance
■Exceptionally low thermal resistance
■No Fiberglass reinforcement
■Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
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Thermal Gap Filler 、 innovative, high performing thermal material |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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11-29-22 |
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A18314-00 |
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265 KB |
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