Tflex™ SF10 Application Guide
■Shelf life for Tflex SF10 is 2 years from date of shipment at the storage conditions specified below.
●Storage Conditions:
■Recommended storage conditions are 0-35°C and relative humidity of 50% maximum. Store in original product packaging until ready for use.
■It is not recommended to store this product under excessive weight, as the product is susceptible to deflection at very low pressure.
●Storage After Applied to a Component:
■It is recommended to keep product covered and clean after applying it to a component and stored at ambient conditions.
●Handling of Material:
■A light, visible and consistent residue on the liner is normal for this product and it will not affect the product’s performance.
■The gap filler product is designed to be easily deflected in application (high compliancy) and can therefore stretch or compress when handled.
■During shipping and handling, the gap filler product can prematurely release from areas of the carrier liner.
■The premature release is visibly noticeable as voids or bubbles between liner and gap filler. This behavior does not impact the performance of the product as long the thickness remains in tolerance (+/- 10% of nominal thickness).
|
|
|
|
Solutions |
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
10/30/2023 |
|
|
|
A18319-00 |
|
300 KB |
- +1 Like
- Add to Favorites
Recommend
- Laird Releases Tflex™ Sf10 Series, a Silicone-free Gap Filler Delivering 10 W/mk Thermal Conductivity
- Laird Signed an Authorized Distributor Agreement with Sekorm
- Laird Offers Solutions for Datacenter Optical Transceivers and Modules
- Laird Performance Materials‘ new electrically conductive elastomers EcE 130 and EcE 135
- The Laird™ Ttape™ 1000A thermally conductive adhesive tape delivers best-in-class thermal resistance
- Laird Performance Materials‘ Graphite-over-Foam, GOF3000 thermal and EMI gasket,Shield EMI and transfer heat in compact spaces
- Sekorm Offers More Than 150,000 Electronic Components in Stock, Ensuring Supply Chain Assurance
- Ultra-Fast Soft Recovery Diode Module ESF100SS60S, Optimized to Reduce Losses and EMI/RFI in High Frequency Power Conditioning Electrical Systems
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.