CHIPBOND TECHNOLOGY CORPORATION IATF 16949:2016 Provision of Wafer Bumping Service.
●The management system of:
CHIPBOND TECHNOLOGY CORPORATION
●has been assessed and certified as meeting the requirements of:
IATF 16949:2016
●For the following activities:
Provision of Wafer Bumping Service.
|
|
|
|
Test Report |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
October 19,2020 |
|
|
|
|
|
TW05/0022.01 |
|
|
614 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
