Wafer Bumping SERVICE SOLUTIONS

PublishTime：2021-12-30

Amkor maintains strong initiatives in the area of technology development to further support customers’ future needs. Continuous improvement programs are in place to optimize and cost-reduce wafer bumping processes.
Amkor’s technology leadership continues to advance flip chip technology as part of our broad portfolio of over 1000 packages. We continue to partner with leading companies to bring new flip chip products to market quickly. We have the vision and breadth to move flip chip interconnect off the drawing board and into production across a wide range of package formats.

Brand of Product：	AMKOR
Part#：
Product Category：	flip chip 、 Wafer Level Chip More
Application：	More
Data Type：	Supplier and Product Introduction More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	WLCSP;FCBGA;BGA
Language：	English Chinese Chinese and English Japanese
Date of Creation：	10/18
Version Number：	Rev 10/18
Data Encoding：	SS15N-EN
Data Size：	1.6 MB

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