Flip chip die
●This application note provides guidelines for the use of flip chip dies with plated solder bumps, or copper pillar bumps, which are shipped to customers in tape and reel or on film frame carrier.
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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3 March 2020 |
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Rev. 4 |
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AN11761 |
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150 KB |
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