GWM8205 Wafer Information
●Wafer Name：GWM8205
●Wafer Diameter： 8 inchs(±0.1 inchs)
●Die Size： 740um * 500um
●Scribe Line： Width 60um
●Wafer Thichness： 8 mil(±0.6 mil)
●Metalization(Back Side)： Ti/ Ni/ Ag
●Metal Thickness(Back Side)： 1.4um
●Metalization(Front Side)： Al/ Cu
●Metal Thickness (Front side) ：4 um
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Datasheet |
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Please see the document for details |
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TSSOP-8 |
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English Chinese Chinese and English Japanese |
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2018/7/26 |
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83 KB |
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