CERTIFICATE STATS CHIPPAC PTE LTD 1.Design and Development ICs Package and Test Hardware and Software 2.Wafer Sort,Wafer Process,Assembly and Test of ICs 3.Package WLCSP (Wafer Level Chip Scale Packages) Bump and Integrated Passive Device and eWLB (Embedded Wafer Lever Ball Grid Array) ISO 9001:2008
●The Certification Body of TUV SUD PSB Pte Ltd certifies that STATSCHIPPAC PTE LTD
●has established and applies a Quality Management System for
Design and Development of ICs Package and Test Hardware and Software
Wafer Sort,Wafer Process,Assembly and Test of ICs
Packages WLCSP(Wafer Level Chip Scale Packages),Bump and Integrated Passive Device and eWLB(Embedded Wafer Level Ball Grid Array)
●Proof has been furnished that the requirements according to ISO 9001:2008 are fufilled.
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Test Report |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2016-07-14 |
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96-2-0622 |
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537 KB |
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