MANAGEMENT SYSTEM CERTIFICATE FlipChip International, LLC ISO/TS 16949:2009 MANUFACTURE OF WAFER INTERCONNECTS THAT ENABLE SEMICONDUCTOR AND MICROELECTRONIC ATTACHMENT DIRECTLY TO PRINTED CIRCUIT BOARD OR CHIP CARRIERS, WAFER THINNING, DICING AND PACKAGING
●This is to certify that the management system of FlipChip International, LLC
●has been found to conform to quality management system standard:ISO/TS 16949:2009
●This certificate is valid for the following Scope: MANUFACTURE OF WAFER INTERCONNECTS THAT ENABLE SEMICONDUCTOR AND MICROELECTRONIC ATTACHMENT DIRECTLY TO PRINTED CIRCUIT BOARD OR CHIP CARRIERS, WAFER THINNING, DICING AND PACKAGING
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Test Report |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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22 August 2016 |
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0246024 |
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305 KB |
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