Thermal Performance of EPC eGaN® FETs

PublishTime：2021-06-17

Thermal resistance is a major factor in determining the capabilities of discrete power devices. From a device’s thermal characteristics both the maximum power dissipation and maximum current can be derived for user applications. While the thermal performance of traditional silicon MOSFETs is well understood, measuring the thermal performance of eGaN® FETs requires some further explanation. This Applications Note investigates the testing method and results of thermal resistance measurements on eGaN FETs.

Brand of Product：	EPC
Part#：	EPC1014 、 EPC1015 、 EPC1009 、 EPC1005 、 EPC1007 、 EPC1001 、 EPC1013 、 EPC1011 、 EPC1012 、 EPC1010 More Part#
Product Category：	EPC eGaN® FETs More
Application：	More
Data Type：	Application note & Design Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2019
Version Number：
Data Encoding：	AN011
Data Size：	474 KB

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