SpeedWave™ 300P Prepreg Datasheet
SpeedWave 300P prepregs exhibit excellent fill and flow capability around heavy copper features, a low z-axis expansion for plated through hole reliability, and are CAF resistant. SpeedWave is also compatible with modified FR-4 fabrication processes.
The SpeedWave prepreg system offers a low dielectric constant of 3.0 – 3.3 and a low dissipation factor of 0.0019 – 0.0022 at 10GHz with stable performance over a broad frequency range. These materials also offer excellent thermal reliability for demanding high layer count designs requiring multiple sequential laminations.
SpeedWave 300P prepreg is UL-94 V-0 rated and compatible with lead-free processing.
Features and Benefits:High performance ultra-low loss prepreg system compatible with a variety of Rogers’ High Frequency and High Speed Laminates
• Excellent fill and flow
• Low Dk glass with spread and open weave offerings
• CAF resistant
• Compatible with modified FR-4 processes.
Ideal for high layer count designsCapable of multiple sequential laminationsLead-free process compatible.
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[ 5G mmWave ][ High resolution 77 GHz automotive radar ][ Aerospace ][ Defense ][ IP infrastructure ][ Backplane ][ Line card ][ Optical transceiver ][ High performance computing ][ Automated test equipment (ATE) ] |
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