GT Series Thermal Pad
●Thermal Pad: By using a special process, the silicone is used as the base material, by adding a thermal conductive powder and flame retardant together to make the formula become this thermal interface material. Our GT Series is effective in lowering the thermal resistance between the heat source and the heat sink
●Features:
■Smooth surface & low contact resistance
■Usable over a wide temperature range
■Electrical insulation; high breakdown voltage
[ Electronic components ][ IC ][ CPU ][ MOS ][ LED ][ Motherboard ][ Power Supply ][ Heat Sink ][ LCD-TV ][ Notebook ][ PC ][ Telecoms ][ Wireless Hub ][ DDR ll Module ][ DVD Applications ][ Hand-set Applications ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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190819 |
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Version 1. |
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514 KB |
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