Smiths Interconnect Announced DC – 20GHz Wideband Surface Mount Fixed Attenuators TT9 SMT series
Smiths Interconnect announced the release of its TT9 SMT series, a DC – 20GHz wideband surface mount fixed attenuator series optimized to provide performance and power to applications in the defence market.
Utilizing more than 40 years of experience in refining attenuation solutions for the defence, the TT9 offers a power handling capability of 500mW while maintaining excellent impedance matching in an SMT package. The TT9 offers outstanding performance for high-frequency applications, both fixed and temperature variable designs in the same footprint, and is ideal for the exacting needs of the defence market, specifically for radar, communication, and electronic warfare applications.
The TT9 SMT series has undergone significant qualification testing with proven results of robust performance in extended durations and extreme environments. In addition, the RF performance has been characterized on Smiths Interconnect test fixtures with evaluation boards and s-parameters available upon request for ease of design.
These devices have been noted for their excellent performance and small size, measuring only 0.070” X 0.060” (1.78 mm X 1.62mm). The TT9 wideband fixed attenuator handles 500mW of input power and is available in dB values from 0 to 10 dB in 1 dB increments. The same footprint is also offered in a temperature variable version, the WTVASMTF series, for ultimate design flexibility. This product is available in a RoHS-compliant solder finish and can be supplied on tape and reel for high-volume pick and place-applications.
In addition, Smiths Interconnect designs custom variations for the frequency band of specific applications on request for defence, aerospace, and telecom markets.
“Our TT9 SMT attenuators push the boundaries of power handling and RF performance to meet the stringent needs of the most demanding applications”, says Paul Harris, VP of Sales and Marketing. “They are developed to meet the ever-growing demand of higher power while ensuring a lower lifecycle cost and excellent signal integrity.”
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